Polymethacrylate molding compound with high heat deflection temperature and stability against thermal degradation

US5530080A · kind A · utility

Assignee

• Roehm GmbH Chemische Fabrik · DE

Inventors

• Werner Siol · Pfungstadt, DE
• Michael Wicker · Seeheim-Jugenheim, DE
• Klaus Koralewski · Riedstadt, DE
• Ulrich Terbrack · Reinheim, DE

Key dates

• Filing date: Dec 1, 1994
• Grant date: Jun 25, 1996
• Expiry date: Dec 1, 2014

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08F2/02
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention relates to a polymerization process for the production of polymethacrylate molding compounds having high heat deflection temperature and high stability against thermal degradation, are prepared by polymerizing methacrylate monomer in a reaction medium such that at least 70 wt. % of the polymethacrylate molding compound is produced at a monomer concentration in the reaction medium of at least 5 mol per liter.