Apparatus for temperature controlled laser sintering
US5530221A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1994 |
| Grant date | Jun 25, 1996 |
| Priority date | — |
| Expiry date | Sep 30, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A temperature-controlled laser sintering system includes a laser beam 12 which is focussed onto a sintering bed 38 by a focussing mirror 26 and a set of scanning mirrors 32, 34. Thermal radiation 114 emitted from the sintering bed 38 are imaged to the scanning mirrors and to a dichroic beamsplitter 110 which reflects such radiation but passes the wavelength of the laser beam 12. The radiation 118 is focussed onto an optical detector 126 which provides a signal on a line 128 to a power control circuit 104. The power control circuit 104 controls a modulator 100 which modulates the power of the laser beam 112 so as to maintain the thermal radiation emission 114 (and thus the temperature at the sintering location) at a substantially constant level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.