Semiconductor chip having a dam to prevent contamination of photosensitive structures thereon
US5530278A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1995 |
| Grant date | Jun 25, 1996 |
| Priority date | — |
| Expiry date | Apr 24, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In dicing of semiconductor chips from a wafer and mounting of the chips in an apparatus, techniques ensure the integrity of bonding pads and wire bonds in the dicing of individual chips and the connection of wire bonds to the chips. The wire bonds in the undiced chips are each connected to a probe pad disposed in an inter-chip area on the wafer, and this probe pad is used to accept probe pins which may otherwise damage the bonding pads on the chips themselves. In the dicing step, the probe pads are obliterated by the cutting blade. A polyimide dam disposes adjacent the bonding pads restricts the migration of liquid encapsulant securing the wire bonds to the bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.