Patent · US Expired

System and method for packing heat producing devices in an array to prevent local overheating

US5530658A · kind A · utility

17Cited by
3References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 7, 1994
Grant dateJun 25, 1996
Priority date
Expiry dateDec 7, 2014

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A configuration management subsystem of a subsystem array system assigns heat producing devices to clusters such that the number of devices activated will not create overheating, regardless of which limited set of clusters is activated. The subsystem receives the dimensions of the disk array, the number of devices, the number of cluster groups and the maximum number of clusters that can be operated substantially simultaneously, and the dimensions of a critical box that defines an arrangement of the devices into cells such that, if a device is assigned to each cell of the critical box and all devices are operated simultaneously, then thermal operating restrictions of the devices will be exceeded. The system first executes simple numbering loop operations to determine, if they exist, dimensions of a building block subarray that meet certain requirements relative to the input parameters. Using this building block subarray, the system then executes other simple numbering loop operations in which number labels are assigned to the disk devices (representing assignment of devices to disjoint clusters) such that if the maximum number of clusters are operating simultaneously, in every criti…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.