Sputter cathode
US5531876A · kind A · utility
2Cited by
5References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1995 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Feb 23, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3407
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The target (5) of a sputter cathode 3 is permanently bonded to a metallic backing plate (14, 15) with a coefficient of thermal expansion similar to that of the target (5). This backing plate (14, 15) is held removably on the electrode (4), for example by means of spring clips (16, 17).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.