Method of manufacturing a casing for an electronic apparatus
US5531950A · kind A · utility
41Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1994 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | May 31, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2571/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a casing for electronic apparatus use in which metal and resin are subjected to a hybrid formation, so that the mechanical strength of the casing is improved and the thickness is reduced so as to reduce the weight. An electronic apparatus casing having a rib (16) and boss (18) is manufactured when metal (10) and resin (12) are integrally formed. Adhesive (14) is coated on the metal, and after the coated adhesive has been dried, the resin (12) is injected onto the adhesive layer from a portion which composes the rib or boss, so that the metal and resin are subjected to a hybrid formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.