Cadmium-free silver alloy brazing solder, method of using said solder, and metal articles brazed with said solder

US5531962A · kind A · utility

Assignee

• Degussa AG · DE

Inventors

• Wolfgang Weise · Frankfurt, DE
• Alexander Voelcker · Rodenbach, DE
• Dieter Kaufmann · Heidenheim, DE
• Willi Malikowski · Aschaffenburg, DE
• Joerg Beuers · Gelnhausen, DE
• Harald Krappitz · Kirchheim unter Teck, DE

Key dates

• Filing date: Aug 3, 1994
• Grant date: Jul 2, 1996
• Expiry date: Aug 3, 2014

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K35/3006
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Cadmium-free brazing solders with working temperatures under 630.degree. C. containing 45 to 80 wt. % silver, 14 to 25 wt. % copper 10 to 25 wt. % gallium, 1 to 7 wt. % zinc and 0 to 5 wt. % indium and/or tin. The alloys have good cold workability and ductility.