Composition for treating copper or copper alloy surfaces
US5532094A · kind A · utility
54Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1995 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Feb 27, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time effective to roughen them with an aqueous solution comprising an azole compound, a copper compound dissolvable in the solution, an organic or inorganic acid and a halogen ion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.