Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board
US5532105A · kind A · utility
22Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 1993 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Aug 9, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A photolithographically viahole-forming photosensitive element is formed of a light-transmitting base material and a photosensitive resin composition laminated as a layer on the light-transmitting base material. The photosensitive resin composition comprises: PA1 (a) 100 parts by weight of a mixture comprising: PA2 (a-1) 10 to 90 parts by weight of a rubber, PA2 (a-2) 5 to 40 parts by weight of a phenol resin, and PA2 (a-3) 10 to 80 parts by weight of an epoxy resin; PA1 (b) 1 to 10 parts by weight of an epoxy resin photoinitiator; and PA1 (c) 1 to 10 parts by weight of an aromatic polyazide compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.