Thixotropic fluorosilicone gel composition
US5532294A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1994 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Jun 17, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A silicone gel composition comprising (A) a linear organopolysiloxane having a backbone consisting only of trifluoropropyl-substituted siloxane units and terminated with alkenyl group, (B) an organohydrogenpolysiloxane, (C) a platinum catalyst, and (D) a finely powdered silica whose surfaces have been rendered hydrophobic by treatment with a silicon compound having only methyl groups as substituent groups, such as hexamethyldisilazane, trimethylchlorosilane, dimethyldichlorosilane, methyltrichlorosilane, trimethylalkoxysilane, dimethyldialkoxysilane, methyltrialkoxysilane and cyclic or linear dimethylpolysiloxanes. The composition has good thixotropy and can effectively provide a protective layer by spot potting. The silicone gel formed from the composition is excellent in solvent resistance, etc. and is effectively restrained from shrinkage or the like. Therefore the composition is highly suited to use as a protective material for semiconductor-type pressure sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.