Process for preparing polyamideimide resins having high molecular weight
US5532334A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1994 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Nov 14, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/303
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for preparing polyamideimide resins having high molecular weights as described wherein major problems of prior art processes such as low heat resistance and low melt flowability are improved. Polyamideimide resins having an intrinsic viscosity of 0.4 to 1.50 dl/g as measured on a solution of dimethylacetamide as a solvent at a concentration of 0.5 g/dl at 30.degree. C., are prepared by reacting an aromatic tricarboxylic acid anhydride with an aromatic diamine in N-methyl pyrrolidone solvent in the presence of a first catalyst selected from a group consisting of thionyl chloride, p-toluenesulphonly chloride, sulfuryl chloride, cyanuric chloride and phosphorus trichloride at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours and further reacting the resultant reaction mixture in the presence of a second catalyst which is a compound of the formula (RO).sub.3 P wherein R is an aliphatic or aromatic substituent, or a compound which is phosphoric acid, pyrophosphoric acid, phosphorous pentaoxide or phosphorous pentachloride as a second catalyst at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.