Snap-in resilient emi grounding clip apparatus for computer structures
US5532428A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1994 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Mar 23, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0016
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To reliably maintain an EMI grounding connection between a sheet metal computer chassis wall and a computer cover wall that may be removably placed against the outer side of the chassis wall, a lance structure is formed in the chassis wall, and opposing installation notches are formed in the chassis wall on opposite sides of the lance opening. Transversely enlarged end portions of an elongated arcuate sheet metal grounding strip are inserted inwardly through the wall notches and captively retained within the lance structure with a longitudinally intermediate portion of the arcuate strip body extending outwardly through the chassis wall lance opening. When the cover wall is operatively installed on the chassis wall the grounding strip is resiliently flattened and compressed between the lance strip and the installed cover wall to maintain an EMI grounding path between the contiguous chassis and cover walls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.