Reverse side etching for producing layers with strain variation
US5532510A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1994 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Dec 30, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/85
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A new method to fabricate strain patterns on a strained semiconductor structure, is disclosed. The method is based on the new concept of reverse side etching of a laterally homogeneous, strained structure so that strain changes can be induced in the front-side, pre-strained area as a result of the reverse side etching process. Semiconductor structures such as quantum-wires, quantum dots, and quantum well devices may be formed by the disclosed methods where the reverse side etching provides strain control of the material properties of the semiconductor structure without processing the front side which is generally the active and the most sensitive region of the semiconductor structure. Such semiconductor structures can be formed by a process including the steps of forming a strained layer on the front-side of the structure, and etching the reverse side of the substrate to form a pattern of strain into the front-side, thus forming selectively strained regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.