Wiring substrate
US5532906A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1995 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Jul 21, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/094
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes a ceramic substrate having a first conductive connection pattern on an lower surface of the ceramic substrate and a second conductive connection pattern on an upper surface or the lower surface of the ceramic substrate, a multilayered wiring portion arranged on the lower surface of the ceramic substrate through the first conductive connection pattern and including an insulating layer made of an organic polymer, on which an integrated circuit and/or a circuit part are/is mounted, and a flexible wiring substrate, connected to the second conductive connection pattern, for connecting the integrated circuit and/or the circuit part to an external circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.