Circuit design for point-to-point chip for high speed testing
US5532983A · kind A · utility
3Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1992 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Dec 30, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R35/005
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test assembly for testing integrated circuits. The assembly includes a test chip that is located between the integrated circuit (IC) and a tester. The test chip has a very low input capacitance that approximates an open circuit, and has an impedance that matches the impedance of the integrated circuit and tester. The matching impedance of the test chip reduces the amount of signal ringing between the integrated circuit and tester.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.