Method for bonding of a ceramic body and a metallic body
US5534103A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1994 |
| Grant date | Jul 9, 1996 |
| Priority date | — |
| Expiry date | Oct 5, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S228/903
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Proposed is a method for bonding of a ceramic body and a metallic body at a relatively low temperature not to cause substantial deformation or material degradation of the ceramic and metallic materials. The surface of the ceramic body is first irradiated with laser beams in vacuum so that the inorganic non-volatile constituent of the ceramic material, e.g. silicon when the ceramic is silicon nitride, is isolated on the surface of the ceramic body forming a layer. Thereafter, the metallic body is brought into contact with and pressed in vacuum against the thus laser beam-irradiated area of the ceramic body under an adequate pressing force and at an elevated but relatively low temperature which is, for example, not higher than 0.5Tm .degree.C., Tm .degree.C. being the melting point of the metallic material, so that the ceramic and metallic bodies are firmly bonded together. It is preferable that the surface of the metallic body is subjected beforehand to an activation or cleaning treatment, for example, by the bombardment with ion beams of an inert gas, e.g., argon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.