Thermal isolation microstructure
US5534111A · kind A · utility
40Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 29, 1988 |
| Grant date | Jul 9, 1996 |
| Priority date | — |
| Expiry date | Feb 29, 2008 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0109
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal isolation microstructure fabricated by a process which allows the ultra thinning of support legs for the microdetector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.