Hot melt adhesive composition
US5534575A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1995 |
| Grant date | Jul 9, 1996 |
| Priority date | — |
| Expiry date | Jan 30, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Hot melt adhesives which include at least 5% of a thermoplastic elastomer block copolymer having a Vicat softening temperature of at least 60.degree. C. and a melting point of at least 100.degree. C., have improved thermal resistance properties and can be applied with conventional hot melt application equipment at temperatures of between about 149.degree. C. and about 204.degree. C. The adhesives are particularly suited to use in above-the-belt locations in automobile interiors and in furniture bonding. Especially suitable thermoplastic elastomers are polyether-polyester and polyether-polyamide segmented polymers with melting points above 149.degree. C. Hot melt adhesives based on these thermoplastic elastomers can be formulated to provide a range of properties including pressure sensitive properties and contact adhesive properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.