High temperature polyether imide compositions and method for making
US5534602A · kind A · utility
9Cited by
8References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1993 |
| Grant date | Jul 9, 1996 |
| Priority date | — |
| Expiry date | Apr 19, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/1064
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyetherimide compositions are provided having condensed bis (4-aminophenyl) sulfone units, diaminophenylindane units or a mixture thereof. These polyetherimides compositions have been found useful for making high temperature chip adhesives, laminating adhesives and film adhesives for high density interconnects in electronic circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.