Lead wire forming apparatus capable of preventing the peeling of the solder from the lead wire
US5535789A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 1994 |
| Grant date | Jul 16, 1996 |
| Priority date | — |
| Expiry date | Sep 2, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
First and second dies are movably opposed to each other. The second die is for pinching a package and a lead wire of the package in cooperation with the first die with a portion of the lead wire that protrudes from the first and the second dies. A slidable base is slidably supported on a die surface of the first die and has an inclined surface. A base pushing rod is movable in a direction which is substantially perpendicular to a base surface of the slidable base. The base pushing rod has an inclined rod surface which is opposed to the inclined surface. A spring urges the slidable base to make the inclined base surface be brought into contact with the inclined rod surface. The base pushing rod moves the slidable base towards the package together with one end portion of the lead wire that is supported on the slidable base when the protruded portion of the lead wire is pushed by the wire pushing member. The slidable base may have a cam follower internal surface which defines a cam hole. In this case, a cam roller is inserted in the cam hole. The slidable base may be moved by the cam roller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.