Process for manufacturing transparent conductive film wiring board
US5536466A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1993 |
| Grant date | Jul 16, 1996 |
| Priority date | — |
| Expiry date | Apr 27, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing a transparent conductive film wiring board capable of being practiced according to a dry procedure to simplify the manufacturing and reduce the manufacturing costs. First, a SiO.sub.2 layer is provided on a substrate and then a black ITO film is formed on the SiO.sub.2 layer. The black ITO film is subject to processing using laser emitted from an output horn, resulting in being cut into a predetermined wiring pattern. Metal evaporated by laser processing is sucked by a vacuum suction head. Then, the substrate is subject to calcination to oxidize and crystallize the black ITO film 3 of the wiring pattern to form a transparent ITO film of the wiring pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.