Polyimide precursor, polyimide and metalization structure using said polyimide
US5536584A · kind A · utility
24Cited by
5References
43Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 29, 1993 |
| Grant date | Jul 16, 1996 |
| Priority date | — |
| Expiry date | Jan 29, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metalization structure uses a surface protective film formed of a polyimide that is produced by heating and dehydrating polyimide precursor has its molecular chain composed of recurring units represented by the following general formula (1) and recurring units represented by the following general formula (2): ##STR1## (where R.sup.1 is at least one tetravalent organic group selected from among ##STR2## R.sup.2 is at least one divalent organic group of a linear structure as selected from among ##STR3## and R.sup.3 is a divalent organic group of a crooked structure that has at least two aromatic rings).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.