Apparatus for and method of manufacturing semiconductor wafer
US5537325A · kind A · utility
68Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1994 |
| Grant date | Jul 16, 1996 |
| Priority date | — |
| Expiry date | Apr 28, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
When an ingot is sliced into wafers, they are given serial numbers for identification. This makes possible to identify which any wafer being processed is of those sliced from the ingot no matter where the wafer is in a manufacturing process. Each wafer is traced so as to determine the path along which the wafer was transferred during the manufacturing process, and results are stored as wafer information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.