Cathodic sputtering system
US5538609A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 1995 |
| Grant date | Jul 23, 1996 |
| Priority date | — |
| Expiry date | May 24, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An evacuable chamber serving as a cathode contains a rotatable magnet system and is connected to a high frequency power supply for sputtering a target. The chamber is electrically isolated from an evacuable housing containing the substrate to be coated, the chamber being covered by a cup-like shield fixed to the housing to define an interior space. A pipe for evacuating the chamber includes first and second sections separated by a gap and connected by an electrically insulating collar in which parallel metal grids are installed in the gap and respectively connected to the power source and to ground in order to prevent the formation of secondary plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.