Process for copper plating a wiring board
US5538616A · kind A · utility
4Cited by
4References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 1, 1995 |
| Grant date | Jul 23, 1996 |
| Priority date | — |
| Expiry date | Jun 1, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0344
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.