Epoxy-free, heat-curable coating system
US5538759A · kind A · utility
7Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1995 |
| Grant date | Jul 23, 1996 |
| Priority date | — |
| Expiry date | Aug 23, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/934
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat-curable, epoxy-free coating system of binder resin is based on a hydroxyl-terminated polyester resin (a) with a hydroxyl number of from 20 to 200 mg KOH/g and a glass transition temperature of at least 40.degree. C., a carboxyl-group-containing, reversibly blocked polyisocyanate (b) and a b-hydroxyalkylamide (c) having at least two b-hydroxyalkylamide groups per molecule, and optionally further additives dictated by the usage and processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.