Resist ink composition and cured article prepared therefrom
US5538821A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | May 9, 1994 |
| Grant date | Jul 23, 1996 |
| Priority date | — |
| Expiry date | May 9, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0388
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a resist ink composition characterized by comprising a specific unsaturated polycarboxylic acid resin (A) or a specific unsaturated polycarboxylic acid/urethane resin (A'), a photopolymerization initiator (B), a diluent (C), and a curing component (D) and a cured article prepared therefrom. In the formation of a solder resist pattern via selective UV-exposure through a patterned film followed by development of the unexposed part, the composition of the present invention is excellent in developability even though at a small acid value (mg KOH/g) or over a prolonged drying time and shows a resistance of the exposed part against the developing solution. Further, a cured article prepared therefrom is excellent in electroless gold plating resistance and fully satisfactory in adhesion and soldering heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.