Stable, one-component, curable epoxy/polyamide resin dispersions
US5539025A · kind A · utility
11Cited by
16References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1995 |
| Grant date | Jul 23, 1996 |
| Priority date | — |
| Expiry date | Mar 16, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Stable, one-component, curable epoxy resin and polyamide resin dispersions and methods for the preparation of the same are described, wherein the polyamide resin dispersion has a stability enhancing, water soluble, dipolar chemical moiety.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.