Solventless compounding and coating of non-thermoplastic hydrocarbon elastomers
US5539033A · kind A · utility
56Cited by
15References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 1994 |
| Grant date | Jul 23, 1996 |
| Priority date | — |
| Expiry date | Mar 21, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.