Resist ink composition, printed circuit board produced by using the composition and process for producing the printed circuit board
US5539064A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1995 |
| Grant date | Jul 23, 1996 |
| Priority date | — |
| Expiry date | Sep 12, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance printed circuits and which comprises an ultraviolet-curable resin obtained by copolymerizing (a) from 5 to 50% by weight of an ethylenically unsaturated monomer of a general formula: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents a hydrogen atom or an alkyl group; n represent an integer of from 1 to 4, and/or glycerol mono(meth)acrylate, (b) from 10 to 90% by weight or glycidyl (meth)acrylate and (c) from 0 to 80% by weight of other ethylenically unsaturated monomers capable of copolymerizing with these (a) and (b), followed by reacting the resulting copolymer with from 0.7 to 1.2 equivalents, relative to one epoxy equivalent of said copolymer, of (meth)acrylic acid and a saturated or unsaturated polybasic acid anhydride; a photopolymerization initiator; a diluent; and a thermosetting epoxy compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.