Substrate subassembly for a transistor switch module
US5539254A · kind A · utility
56Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1994 |
| Grant date | Jul 23, 1996 |
| Priority date | — |
| Expiry date | Mar 9, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate subassembly for a high power module, and methods involving the same. The substrate subassembly contains only one switching transistor and has at least one integral short terminal lead tab. The substrate subassemblies can be pretested at significant operating current, to obtain enhanced characterization and matching of mounted switching transistors. Trimmable gate lead resistances can be incorporated in the substrate subassemblies. Enhanced compositional, geometrical and electrical module symmetry is available. New module structures and method are afforded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.