Composite plating method for hollow member
US5540829A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1994 |
| Grant date | Jul 30, 1996 |
| Priority date | — |
| Expiry date | Dec 27, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D15/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a disclosed composite plating method for a hollow member, an insertion electrode is loosely inserted with a space into a cylinder of a hollow member, a composite plating solution supplied from a solution supply pipe is circulated into the space of the cylinder, a base metal electrode is connected to the hollow member and composite plating is applied onto the inner peripheral surface of the hollow member. The current density between the insertion electrode and the inner peripheral surface of the hollow member is set at a low value at the beginning and is increased after a lapse of a predetermined time. More preferably, bubbles are produced by supplying gas into the composite plating solution almost simultaneously with the above-mentioned increase of the current density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.