Printed circuit board having a land with an inwardly facing surface and method for manufacturing same
US5541367A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 31, 1994 |
| Grant date | Jul 30, 1996 |
| Priority date | — |
| Expiry date | Oct 31, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board is provided having one or more lands formed upon the outer surface of the printed circuit board. Each land is adapted to receive a surface mount component and, specifically, leads extending from the surface mount component. Each land is fabricated having an inwardly facing exposed surface which, when the lead is placed upon the land, directs or channels the lead toward the center of the land to enhance interconnect accuracy of the lead to the land. Moreover, various configurations of solder are placed upon the land, wherein the solder can be deposited at select regions on the land or at a controlled thickness. Careful placement of solder helps ensure the lead, once placed, will not migrate or misalign from the land during subsequent reflow. Careful placement of solder helps minimize surface tension imbalance of the molten solder by assuring surface migration in a controlled direction to the middle of the land.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.