Coaxial vias in an electronic substrate
US5541567A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 1994 |
| Grant date | Jul 30, 1996 |
| Priority date | — |
| Expiry date | Oct 17, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Structures are described having vias with more than one electrical conductor at least one of which is a solid conductor which is formed by inserting the wire into the via in a substrate wherein the wire is attached to an electrically conductive plate which is spaced apart from the substrate by a spacer which leave a space between the substrate and plate. The space is filled with a dielectric material. The space with via between the conductor and via sidewall is filled with a dielectric material. The via is used for making transformers and inductors wherein one of the via conductors is used for inner windings and another of the via conductors is used for outer windings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.