Personalizable multi-chip carrier including removable fuses
US5541814A · kind A · utility
12Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1993 |
| Grant date | Jul 30, 1996 |
| Priority date | — |
| Expiry date | Oct 8, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A personalizable multi-chip carrier including a substrate, first and second pluralities of conductors arranged on respective first and second parallel planes, the first and second pluralities of conductors defining a grid of conductors arranged over the substrate and defining a multiplicity of crossing locations at which conductors of the first and second pluralities cross each other, apparatus for interconnecting the first and second pluralities of conductors at locations adjacent the multiplicity of crossing locations and including a plurality of fusible links.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.