Dielectric curing
US5542961A · kind A · utility
4Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1995 |
| Grant date | Aug 6, 1996 |
| Priority date | — |
| Expiry date | Mar 28, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Use of dielectric heating to cure a thermosettable resin component of a binder formulation used to secure abrasive particles to a backing in a coated abrasive greatly accelerates the production process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.