Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
US5544773A · kind A · utility
Inventors
Key dates
| Filing date | Jun 2, 1994 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Jun 2, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0793
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a method for making a multilayer printed circuit board having blind holes which comprises heat laminating a copper foil and an inner layer panel previously provided with circuit patterns on one or both sides thereof by processing a copper-clad laminate, a resin layer soluble in an aqueous alkali solution and having a flowability upon heating being present between said copper foil and said inner layer panel, forming via holes in the surface copper foil by etching and then dissolving the resin layer under said via holes with an aqueous alkali solution and removing the resin layer, thereby to form blind holes in which the copper foil on the inner layer panel is exposed. Further provided is a copper foil used for making multilayer printed circuit boards, which is provided with a resin layer soluble in an aqueous alkali solution and having flowability upon heating on its roughened surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.