Method of preparing a metal substrate of improved surface morphology
US5545262A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1994 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Nov 16, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49108
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal surface is now described having enhanced adhesion of subsequently applied coatings. The substrate metal of the article, such as a valve metal as represented by titanium, is provided with a highly desirable surface characteristic for subsequent coating application. This can be initiated by selection of a metal of desirable metallurgy and heat history, including prior heat treatment to provide surface grain boundaries which may be most readily etched. In subsequent etching operation, the surface is made to exhibit well defined, three dimensional grains with deep grain boundaries. Subsequently applied coatings, by penetrating into the etched intergranular valleys, are desirably locked onto the metal substrate surface and provide enhanced lifetime even in rugged commercial environments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.