Apparatus for bonding wafer pairs
US5545283A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 1995 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Feb 8, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C43/32
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for bonding wafer pairs. The apparatus includes a heated platen surrounded by a pressurization vessel. The heated platen includes channels connected to a hole which runs through the heated platen. Wafer pairs are placed on the top surface of the platen, a rubber mat is placed over the top of the wafer pairs, and a vacuum is drawn through the hole and the channels. The rubber mat compresses the wafer pairs. The platen is heated for the bonding process. The pressurization chamber is pressurized supplying additional bonding pressure to the wafer pair. Once sufficiently heated, the heated platen is liquid cooled completing the bonding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.