Method for fabricating self-assembling microstructures
US5545291A · kind A · utility
512Cited by
16References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1993 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Dec 17, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate 20, 70, 90, 120, 200. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then poured evenly over the top surface of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.