Method of using conductive polymers to manufacture printed circuit boards
US5545308A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1995 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Jun 19, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0514
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.