Laser bond header
US5545846A · kind A · utility
24Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1993 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Sep 30, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49213
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is to a header for a power semiconductor device and a method for making the header. A ground pin is mounted or formed on the header mounting base and a header ground lead is placed over the ground pin and fused to the pin by a laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.