Method and apparatus for dissipating heat from a transducer element array of an ultrasound probe
US5545942A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1994 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Nov 21, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10K11/004
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A device for improving heat dissipation inside an ultrasound probe and reducing heat build-up near the transducer face. Heat conductors are placed around the periphery of the transducer package, but within the probe housing, so that heat can be drawn away from the transducer face and toward the rear/interior of the probe. The heat conductors act as conduits for draining away heat which builds up in the thermal potting material during pulsation of the piezoelectric transducer elements. The heat conductors are formed from metal foil having a heat conductivity greater than the heat conductivity of the thermal potting material which fills the spaces inside the probe housing and surrounds the transducer package. The preferred metal foil is aluminum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.