Electrical module mounting apparatus
US5546275A · kind A · utility
27Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1995 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Jun 14, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical module (125) is for mounting upon a circuit board (104). During circuit assembly, the electrical module (125) is placed upon a breakaway portion (117) of the circuit board (104) and a bracket assembly (103) is mounted to the circuit board (104) so as to position the electrical module (125). At the conclusion of circuit assembly, final assembly is initiated and the breakaway portion (117) is removed and the circuit board (104) is mounted into a housing (105). Preferably, the electrical module (125) is in direct contact with the housing (105) so as to maximize heat transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.