Process for electroplating nonconductive surface
US5547558A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1995 |
| Grant date | Aug 20, 1996 |
| Priority date | — |
| Expiry date | Mar 15, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0323
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for directly electroplating a conductive metal to the inner walls of through-holes in printed-wiring boards. The process comprises steps of providing an aqueous dispersion containing graphite particles with an average particle diameter of 2 .mu.m or less or carbon black particles with an average particle diameter of 1 .mu.m or less; applying this aqueous dispersion to a surface of a nonconductive surface substrate; dipping the nonconductive surface in a strong acidic aqueous solution with pH 3 or lower to form a layer of said particles; and electroplating using the particle layer as a conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.