Hotmelt adhesive

US5548027A · kind A · utility

Assignee

• Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

• Reimar Heucher · Pulheim, DE
• Juergen Wichelhaus · Wuppertal, DE
• Kurt Schueller · Monheim, DE
• Siegfried Kopannia · Goldkronach, DE
• Angela Rossini · Marsala, IT

Key dates

• Filing date: Oct 13, 1994
• Grant date: Aug 20, 1996
• Expiry date: Oct 13, 2014

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2666/04
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A hotmelt adhesive based on a number of components is provided. One of the components is at least one polyamide based on dimerized fatty acid, said polyamide being present in an amount by weight of the composition of at least 50%. Another component is from at least one ethylene copolymer selected from the group consisting of ethylene/vinyl acetate, ethylene/acrylate, said acrylate being derived from an alcohol containing 1 to 18 carbon atoms, and ethylene/methacrylate, said methacrylate being derived from an alcohol containing 1 to 18 carbon atoms, said ethylene copolymer being present in an amount by weight of the composition of 5 to 20%. Another component is at least one copolymer of styrene with one or more members selected from the group consisting of ethylene, isoprene and butylene, said copolymer of styrene being present in an amount by weight of the composition of 2 to 10%. Another component is at least one plasticizer, said plasticizer being present in an amount by weight of the composition of 5 to 25% by weight. Optional components are 0 to 10% by weight of at least one tackifying resin from the group consisting of polycyclopentadiene, polyterpene, liquid hydrocarbon resin…