IC card rigidized cover
US5548485A · kind A · utility
16Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1995 |
| Grant date | Aug 20, 1996 |
| Priority date | — |
| Expiry date | Sep 29, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/077
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cover assembly for an IC card includes top and bottom covers (52, 54) with overlapping side rails (70, 80). At each side of the card, a downwardly-extending top side rail (70) lies facewise adjacent to an upwardly extending bottom side rail (80), and a layer (90) of solder is sandwiched between the rails and is bonded to each of them. The solder layer extends along most of the height of each cover side, so the two rails and the solder layer between them serve as a single rigid beam. The cover assembly can be, instead, spot welded at a plurality of locations at each side of the card, to weld the two rails facewise together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.