Multi-layer composite ultrasonic transducer arrays
US5548564A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 13, 1994 |
| Grant date | Aug 20, 1996 |
| Priority date | — |
| Expiry date | Apr 13, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/874
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A piezoelectric transducer chip comprising a plurality of transducer elements. At least one of the transducer elements is a multi-layer element which comprises a plurality of piezoelectric layers, each of which is separated from the adjacent piezoelectric layers by an electrode layer so that a plurality of capacitive elements is electrically connected in parallel. The plurality of piezoelectric layers are comprised of a plurality of piezoelectric members separated from adjacent members by a gap to form a composite piezoelectric layer. Also disclosed is a method of making a multilayer transducer of a composite piezoelectric material. Alternate embodiments include two-dimensional ultrasonic transducer arrays having multilayer elements formed of a composite piezoelectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.