Process for manufacturing integrated circuits using an automated multi-station apparatus including an adhesive dispenser and apparatus therefor
US5549716A · kind A · utility
19Cited by
18References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1993 |
| Grant date | Aug 27, 1996 |
| Priority date | — |
| Expiry date | Apr 13, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing an electronic component and an apparatus therefor capable of permitting die-bonding, wire-bonding and molding to be successively executed on a through-line. Die-bonding for adhesively mounting IC chips on a lead frame, wire-bonding for connecting bonding pads of the IC chips and the lead frame to each other through lead wires, and molding for forming a resin material into an outer package for covering each of the IC chips are successively executed on a through-line while transferring the lead frame by means of a conveyor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.