Method for removing rosin soldering flux from a printed wiring board
US5549761A · kind A · utility
12Cited by
45References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1995 |
| Grant date | Aug 27, 1996 |
| Priority date | — |
| Expiry date | Apr 6, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method for removing rosin soldering flux with aqueous cleaning compositions. The aqueous cleaning compositions can be employed for household use or for cleaning electronic circuit assemblies. The aqueous cleaning compositions contain an alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned and an anionic polymer of a high molecular weight polyacrylic acid which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.